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SanDisk, Hynix partner on 300mm fab

Posted: 09 Aug 2007 ?? ?Print Version ?Bookmark and Share

Keywords:NAND flash memory? 300mm wafer fab? non-volatile memory chips?

Against the background of rising NAND demand, SanDisk Corp. and Hynix Semiconductor Inc. plan to build a joint fab, reported the media in Europe.

According to Europe press reports that all quote an article from Wall Street Journal as source, SanDisk and Hynix plan to widen their cooperation which they agreed upon last March.

Quoting SanDisk CEO Eli Harari, Wall Street Journal writes that the companies plan to invest jointly in the construction of a 300mm wafer fab for NAND flash products. Though Harari did not provide any further details, Wall Street Journal estimates an investment sum of about $2 billion.

German Website which also reported on the topic, wrote that the new fab will be built in Switzerland. The site did not specify its source.

Recently, demand and prices for NAND flash hiked, triggered not least by a power failure at top NAND manufacturer Samsung that caused six production lines to stop. While the problem has been resolved in the meantime, market watchers see rising prices for this type of non-volatile memory chips.

- Christoph Hammerschmidt
EE Times Europe

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