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Thermoelectric material packs performance in paper-thin size

Posted: 20 Aug 2007 ?? ?Print Version ?Bookmark and Share

Keywords:thermoelectric material? thermoelectric performance? paper-thin material?

Nextreme Inc. has enhanced its miniature embedded thermoelectric component (eTEC) material to achieve temperature differentials of 55-60C at room temperature. This achievement compares with the performance of conventional thermoelectric technology, which is physically larger and typically produces 65C under the same conditions. Nextreme devices use proprietary materials that are 5-15?m thick, about 100 times thinner than the typical 1mm thick pellets used in conventional thermoelectric devices.

?It is remarkable that devices no thicker than a piece of paper can deliver this kind of performance,? said David Koester, VP of engineering at Nextreme. ?This should have an immediate impact in photonics and other industries where a lack of an integrated cooling solution is limiting market penetration of various products.?

Nextreme?s eTECs are designed utilizing thin films that are small, thin, fast, efficient and reliable, adding as little as 0.1mm of height to a heat spreader or package, thus enabling unobtrusive integration close to the heat source. The eTEC?s millisecond response time rapidly cools or heats to maintain a precise temperature depending on the needs of the application. A typical device pumps a maximum heat flux of 150W/cm? with some designs delivering as much as 400W/cm? versus 10-20W/cm? for typical bulk TECs.

Prototypes for Nextreme?s eTEC are available for sampling and are expected fully qualified Q3 2007.




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