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A $60M funding for TSMC's packaging tech

Posted: 21 Aug 2007 ?? ?Print Version ?Bookmark and Share

Keywords:TSMC 300mm? wafer-level packaging? capital funding?

Capital appropriations totaling $59.8 million will be set aside by Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) for establishment of 300mm, wafer-level packaging technology. The funds will also be used for wafer-level packaging "capacity to meet future market demand," said Lora Ho, vice president of TSMC.

TSMC did not disclose other details, but it has been developing packaging technology over the last several years. The company has limited internal production, but it mainly works with subcontractors such as Advanced Semiconductor Engineering Inc. (ASE).

Wafer-level packaging technology can effectively reduce the size of end-products and raise the competitiveness of TSMC and its customers.

TSMC has also approved capital appropriations totaling $22.8 million for upgrading a monthly capacity of 12,600 eight-inch wafers in 0.18?m logic process to 11,100 eight-inch wafers capable of high voltage, RF, and BiCMOS processes.

- Mark LaPedus
EE Times

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