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ASE, Mitsui collaborate on HMT packaging tech

Posted: 10 Sep 2007 ?? ?Print Version ?Bookmark and Share

Keywords:hybrid manufacturing? HMT packaging technology? cross-licensing?

Advanced Semiconductor Engineering Inc. (ASE) and Mitsui High-tec Inc. have entered into a cross-licensing agreement and technical collaboration for Mitsui's Hybrid Manufacturing Technologies (HMT) packaging technology. Financial terms for the cross-license agreement were not disclosed.

Under a minimum five-year agreement, the companies will share intellectual property rights and technical expertise for the design and manufacture of HMT semiconductor packaging.

HMT is a leadframe based, area array package with a more flexible footprint than a multi-row QFN and conforms to both JEDEC and JEITA design standards. As HMT utilizes a copper leadframe, it boasts thermal, electrical, reliability and cost advantages over similar laminate based packages. In addition, HMT brings to the market a QFN type package that can penetrate much higher I/O applications, at a competitive cost.

"This agreement will truly benefit our customers, who require leading-edge QFN packaging technologies to ensure their competitiveness in the dynamic semiconductor market," said Ho-Ming Tong, chief R&D officer, ASE Group. "The collaboration will enable ASE and Mitsui to meet stringent market demands and bring added value to our customers worldwide."

"Our HMT technology has been well-received within the industry, therefore it makes sense to work together with industry leader ASE to strengthen the technology, increase market adoption, and accelerate the development of the companies' current and future product lines," said Yasunari Mitsui's corporate VP. "Offering high reliability, HMT is projected to become mainstream technology in the semiconductor field in the near future and we will partner closely with ASE to make this happen."




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