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Firms form forum to promote wafer-level CSP

Posted: 12 Sep 2007 ?? ?Print Version ?Bookmark and Share

Keywords:wafer-level CSP? WLCSP Forum? semiconductor firms?

Major industry firms have joined hands and formed the WLCSP Forum to promote the adoption of semiconductor devices using wafer-level chip scale packages (WLCSP), establish industry sponsored "best practices" for their utilization and establish strategies for migration to finer pitch WLCSP products.

The non-profit mutual benefit corporation's board of directors has representatives from the companies: Amkor Technology Inc., California Micro Devices Corp. (CMD), FlipChip International LLC, Maxim Integrated Products Inc., Nokia Corp., and STMicroelectronics. Kyle Baker, of CMD, will serve as its first Chairman, while Richard Haas, also of CMD, was named president.

According to IC Insights' McClean Report, 6 billion WLCSP devices were produced in 2006, ramping to 19.1 billion units in 2011. Strong market acceptance of these devices is largely due to superior electrical performance, a compact form factor and in many cases, a lower total cost of ownership when compared to other packaging solutions. The WLCSP Forum will be forming topical working groups to address barriers to adoption, best practices, manufacturing and qualification guidelines, and will issue application notes and white papers, as well as recommendations to standards bodies.

The WLCSP Forum will hold an open meeting on Sept. 17 during the 4th Annual International Wafer Level Packaging Conference and Exhibition at the Wyndham Hotel in San Jose, California.

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