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Firms collaborate on etch process for nanoimprint litho

Posted: 13 Sep 2007 ?? ?Print Version ?Bookmark and Share

Keywords:nanoimprint lithography? plasma etching? nanoimprint stamp?

Nanoimprint lithography stamp provider NIL Technology A/S and Oxford Instruments have partnered to develop etch processes targeted at nanoimprint lithography.

The collaboration combined Oxford's process development expertise in plasma etching with NIL's experience in developing templates, stamps and processes. Together the companies have developed processes for the etching of nanoimprinting stamps in fused silica, de-scumming of the imprinted polymer with negligible critical dimension loss, and etch of the final structure.

All three etching steps necessary for the nanoimprint technology have now been developed: etching of the NIL stamp in silicon and fused silica; removal of the residual layer after imprinting; and transfer of the pattern into the substrate (silicon or fused silica).

Brian Bilenberg, chief technical officer at NIL, commented, "We saw an opportunity for NIL Technology and Oxford Instruments to work together to develop processes which are optimized as an overall end-to-end process rather than in individual steps. As we continue further work, we expect to improve the whole process of etching nanostructures created by nanoimprint lithography."

- John Walko
EE Times Europe




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