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Infineon, Hosiden co-develop silicon microphones

Posted: 04 Oct 2007 ?? ?Print Version ?Bookmark and Share

Keywords:silicon microphone? partnership? MEMS?

Infineon Technologies AG and Hosiden Corp. announced they have partnered on silicon microphone projects. Infineon will contribute its semiconductor expertise and MEMS knowledge to develop and produce silicon microphones that are significantly smaller and more rugged than current microphones. On its part, Hosiden will add its competence in supporting Infineon with electromechanics and acoustics, application knowledge for successful integration into devices.

"We combine the strengths of two technologically leading companies to jointly develop a family of silicon microphones. These will have smaller package sizes than today's solutions, enable high-end acoustics for better sound quality and provide digital interfaces for reduced interference," said Peter Schiefer, VP and general manager of the discrete semiconductors business unit for the automotive, industrial and multimarket business group at Infineon.

The Infineon silicon microphone is more rugged and more immune to RF and shocks compared to classical microphones. It also exhibits higher heat resistance withstanding temperatures of up to 260C. Due to the high temperature-resistance, it can be soldered without any loss in sensitivity onto a standard PCB and is ideally suited for use on fully automated production lines.

"By combining Hosiden's acoustic strengths with Infineon's silicon MEMS and ASIC expertise, we can ensure, that our customers get application-optimized, high quality products earlier in their design cycle, combined with a very high level of customer support from both companies," a Hosiden spokesman said. "Our customers ask for the best microphone portfolio, keeping good properties of acoustic, challenging to miniaturize and matching auto-assembly production. With the Infineon partnership, we can close our portfolio gap and offer the best solution for the customer, independent of the various technologies."

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