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System LSI puts 3G in handsets

Posted: 05 Oct 2007 ?? ?Print Version ?Bookmark and Share

Keywords:system LSI? HSDPA? SH-Mobile? W-CDMA? baseband processor?

SH-Mobile G3

Renesas Technology Corp. has launched the SH-Mobile G3, a high-speed, high-performance system LSI designed for use in 3G mobile phones. Renesas developed the chip with NTT DoCoMo Inc., Fujitsu Ltd, Mitsubishi Electric Corp., Sharp Corp. and Sony Ericsson Mobile Communications.

The SH-Mobile G3 is a single-chip LSI which supports HSDPA cat. 8 data transfer at up to 7.2Mbps and dual-mode communications including W-CDMA and GSM/GPRS. It enables high-speed data transfer via mobile phones and is suitable for use in various handset models for Japan and international markets.

The chip integrates both a baseband processor for communication processing and an application processor with enhanced functions. For example, it enables high-level graphics processing with support for large LCD screens such as WVGA (864 x 480pixels), as well as high-quality audio processing.

Previous mobile phone joint development efforts include the SH-Mobile G1, a single-chip LSI for dual-mode handsets supporting W-CDMA and GSM/GPRS. Since the first joint development announcement of NTT DoCoMo and Renesas in July 2004, the G1 entered mass production in the fall of 2006 and it is now used in different mobile phone models. In February 2006, NTT DoCoMo, Renesas, Fujitsu, Mitsubishi Electric and Sharp announced plans to develop a unified 3G mobile phone platform, which consists of the SH-Mobile G2 and supporting software, with extended functionality including HSDPA for fast data transfer (max. 3.6Mbps). The G2 platform is currently under development, and the handsets powered the G2 platform are scheduled to appear in the market from late 2007.

Building on this success, the latest SH-Mobile G3 and the associated mobile phone platform announced in February 2007 will further extend the functionality and support for high-speed communication (up to 7.2Mbps with HSDPA cat. 8). Once the development work is completed in 2008, the full-scale adoption of G3 is expected to bring mobile handsets with more advanced multimedia functionality as well as increased demand for the ability to quickly download large volumes of data such as high-resolution images for large screen displays. The new platform will simplify the development process of mobile handsets by providing advanced functions and helping to shorten development time, said Renesas.

The new mobile phone platform will be a unified implementation which incorporates the G3, a jointly developed reference design including peripheral chipsets such as audio/power and RF font-end modules and base software which includes Symbian OS, a board support package and multimedia middleware.

Shipments of evaluation samples to these handset manufacturers has started this October. Powered by the G3 system LSI, the jointly developed 3G mobile phone platform is targeted for completion in Q3 2008.

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