Malaysian telco aids Silterra on 90/65nm chip production

Foundry Silterra has signed an agreement with the R&D arm of Malaysia's largest communications provider Telekom Malaysia (TM) to assist in its drive to lower process-technology nodes.

Silterra CEO Eg Kah Yee disclosed at a press conference that the company, which already uses RF CMOS process technology to manufacture 0.18- and 0.13?chips, hoped to have 90- and 65nm models commercially available sometime next year.

The partnership will cover design, fabrication and device modeling, and TM is expected to be one of the primary customers for Silterra's next-generation RF output. Silterra recently unveiled a growth strategy that calls for the construction of a new 12-inch fab to churn out 90- and 65nm chips.

- Jonathan Hopfner
EE Times