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Chipset eases TD-SCDMA commercial deployment

Posted: 19 Oct 2007 ?? ?Print Version ?Bookmark and Share

Keywords:TD-SCDMA? commercial deployment? 3G?

TD-SCDMA chipset provider Commit Inc. has announced the release of the MARS-II chipset solution and reference design supporting TD-HSDPA/GSM/GPRS/EDGE.

The new solution promises to facilitate commercial TD-SCDMA deployment as it enables HSPDA, high-end 3G applications, low power consumption and seamless handover between TD-SCDMA and 2.5G communications.

Mars-II solution supports TD-HSDPA/GSM/GPRS/EDGE automatic roaming in idle mode and voice/data handover in connection mode, up to 2Mbps HSDPA transmission, MBMS, embedded multimedia codec for audio, video and image, and end 3G applications such as video telephone, video streaming and high-speed Internet browsing.

The baseband chip in MARS-II is produced in 90nm semiconductor process, which cuts power consumption and cost. This flexible, scalable and open platform likewise allows customers to develop differentiated products.

Commit also developed an evaluation platform, a data card turnkey solution and a completed terminal solution based on MARS-II. These products promises to shorten time-to-market for customers' products.

Engineering samples and reference designs are already available. A number of leading mobile handset OEMs, ODMs and design houses have begun using MARS-II to design TD-SCDMA dual-mode terminal products, which will be launched starting the first half of 2008, in time for the Bejijing Olympics.




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