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IMEC, ASML expand EUV litho ties

Posted: 19 Oct 2007 ?? ?Print Version ?Bookmark and Share

Keywords:EUV lithography? CMOS? 22nm node?

IMEC and ASML Holding NV have has expanded their partnership on the extreme ultraviolet (EUV) lithography front.

Under the terms, ASML plans to install an EUV "pre-production tool" in the European R&D consortium's 300mm facility by 2010, which can enable IMEC and its partners to do research on 22nm CMOS devices. ASML has already installed its alpha-demo EUV tool (ADT) at IMEC and has also installed one at Albany Nanotech.

The first images were obtained from the R&D tool ADT, based on a so-called "Sn source" from Philips Extreme UV. Horizontal and vertical 35- and 40nm lines and spaces in a 100nm MET-2D resist from Rohm & Haas at 18mJ/cm? were exposed with the tool, according to IMEC.

"They represent the first real data, building confidence for EUV to be a viable technology for 32nm half pitch lithography and below," said Luc Van den hove, executive VP and chief operating officer at IMEC, in a statement.

Still, EUV suffers from the lack of viable power sources, resists and a soaring price tag. An EUV tool could run $50 million or more if or when a system reaches the market. Some say EUV will never move into production fabs.

- Mark LaPedus
EE Times

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