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Manufacturing/Packaging??

Collaboration by Elpida, UMC to boost low-k, PRAM

Posted: 24 Oct 2007 ?? ?Print Version ?Bookmark and Share

Keywords:copper low-k? PRAM? technology collaboration?

Japan's Elpida Memory Inc. has formed a joint development program with Taiwan's United Microelectronics Corp. for copper low-k and phase-change RAM (PRAM). Elpida will license UMC's copper low-k backend technology for use in its DRAM production, while UMC will license Elpida's embedded DRAM technology for use in advanced SoC solutions.

In addition, Elpida and UMC will cooperate to develop PRAM technology. The arrangement will couple Elpida's expertise in Ge2Sb2Te5 (GST) materials with UMC's efforts in CMOS logic technologies.

"This agreement with UMC is a significant step forward for future memory development, as copper low-k technology will help drive the production and continued process migration of high performance DRAMs," said Takao Adachi, chief technology officer at Elpida, in a statement.

Elpida also has deals with other foundries, such as SMIC and Powerchip Semiconductor.

Shih Wei Sun, chief operating officer at UMC, said: "We look forward to utilizing the results of our collaboration to bring to market more advanced embedded memory SoC solutions in support of our foundry customers."

- Mark LaPedus
EE Times




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