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Manufacturing/Packaging??

STATS ChipPAC opens second China facility

Posted: 25 Oct 2007 ?? ?Print Version ?Bookmark and Share

Keywords:semiconductor test and advanced packaging service provider? IC subcontractors? manufacturing facility?

STATS ChipPAC Ltd has announced the opening of a second manufacturing facility in Shanghai, China. At 371,000 square feet, the new facility almost doubles the company's current floor space of 422,000 square feet, reinforcing the company's position as the largest full turnkey assembly and test service provider in China. The company offers high-volume, low-cost turnkey solutions including wafer probe, assembly, final test and distribution to support multiple customers in markets such as PC chipsets, computing, consumer and broadband applications.

"China is a growing market and an important strategic location for our customers and our company. STATS ChipPAC has differentiated itself by the depth of our technology portfolio in China, proven high volume manufacturing experience and a successful business model based on full turnkey solutions," said Wan Choong Hoe, the company's executive VP and CEO.

In addition to the floor space expansion, the company has been building its technology portfolio in China with advanced die attach and wire bond processes, advanced mold processes, film die attach and wafer thinning. With high volume production experience in PBGA packages, 3D stacking and SiP solutions, the company is one of the most advanced IC subcontractors in China. It is also adding a turnkey flip-chip solution from bump, sort and assembly to final test in China.




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