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Memory module pair tops JEDEC specs

Posted: 26 Oct 2007 ?? ?Print Version ?Bookmark and Share

Keywords:DDR3 memory module? JEDEC standard?

Virtium Technology Inc. has come up with a DDR3 Very Low Profile (VLP) and DDR3 Ultra Low Profile (ULP) blade memory modules for embedded computing applications.

Both types of memory modules are designed with key enhancements to the JEDEC standard, including reduced module height and densities up to 2Gbytes and future expansion to 4Gbytes.

Virtium has expanded its DDR3 VLP memory module family by adding DDR3 ULP RDIMM, ULP UDIMM and ULP Mini-RDIMM form factors to its current line of DDR3 VLP SODIMM, VLP SO-RDIMM and VLP SO-CDIMM. The company has boosted the JEDEC VLP memory module standard by offering VLP RDIMMs at densities up to 2Gbytes with future expansion to 4Gbytes. Virtium's ULP memory module series offers DIMM heights of 0.70 inches, enhanced from the JEDEC standard of 0.72 inches.

All Virtium VLP and ULP memory modules are available using monolithic DRAM that have an extended temperature range which makes them ideal for rugged AdvancedTCA memory (ATCA memory), AdvancedMC memory, MicroTCA memory, PicoTCA memory and AMC memory for blade applications, Storage Bridge Bay (SBB) canisters and PICMG SBCs.

- Ismini Scouras

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