Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Controls/MCUs
?
?
Controls/MCUs??

New Intel fab ramps up 45nm chip production

Posted: 29 Oct 2007 ?? ?Print Version ?Bookmark and Share

Keywords:45nm microprocessor? 300mm facility? high-k material?

Intel Corp. has started production of new-generation microprocessors for PCs, servers and other computing devices at its first high-volume 45nm manufacturing factory in Chandler, Arizona.

Called "Fab 32," the $3-billion factory will use Intel's 45nm process technology based on a the company's technology in "reinventing" certain areas of the transistors inside its processors to reduce energy leakage. The 45nm transistors use a Hafnium-based high-k material for the gate dielectric and metal materials for the gate, and are so small that more than 2 million can fit on the period at the end of this sentence. Millions of these tiny transistors will make up Intel's faster, more energy efficient Pb- and halogen-free processors, as well as low-power processors for mobile Internet and consumer electronic devices, and low-cost PCs. The first of the company's 45nm processors is scheduled to be introduced on Nov. 12.

"The opening of Fab 32 in Arizona today is a testament to Intel's continued investment in our most strategic asset the most advanced, environmentally friendly manufacturing network in the world," said Paul Otellini, Intel president and CEO. "The magic of 45nm and our new transistor design allow us to deliver high-performance, energy-efficient processors to our customers across the entire spectrum of market segments, from the most powerful servers to a variety of mobile devices and everything in between."

Fab 32 is Intel's sixth 300mm wafer factory and its second factory to produce 45nm chips. Intel first produced 45nm processors in its Oregon development facility, called D1D, in January and is now moving into high-volume production with the opening of Fab 32. Two additional 45nm, 300mm manufacturing factories are scheduled to open next year in Kiryat Gat, Israel (Fab 28) and Rio Rancho, N.M. (Fab 11x). Using 300mm wafers lowers the production cost per chip while diminishing overall use of resources.

Environment-friendly facility
In addition, Fab 32 will be among Intel's most environmentally friendly factories, incorporating a number of energy and water conservation measures that have come to characterize Intel's long track record of environmental stewardship in its operations.

Intel's 45nm process results in a 15 percent reduction in global warming emissions, and Fab 32 makes use of Intel Arizona's innovative water conservation and reuse program which conserves more than 70 percent of the water.

The company also announced that it intends to seek certification for the new fab as the company's first official Leadership in Energy and Environmental Design (LEED) factory based on new criteria being developed for facilities of this kind. LEED is a green building rating system developed by the U.S. Green Building Council that provides a set of standards for environmentally sustainable construction and requires several months of operating data before certification can be completed.




Article Comments - New Intel fab ramps up 45nm chip pro...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top