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ST, ACS co-develop VII chips for improved road safety

Posted: 06 Nov 2007 ?? ?Print Version ?Bookmark and Share

Keywords:VII initiative? car communications ICs? automotive electronics?

STMicroelectronics (ST) and Automotive Communications Systems (ACS) have partnered to jointly develop communications ICs for Vehicle and Infrastructure Integration (VII).

The VII initiative is investigating the potential safety benefits of car-to-car and car-to-roadside high-speed communications. Contributors to VII activities include the U.S. Federal Government, state governments, car companies, suppliers, consultants and others. If successful, the automotive OEMs would roll out on-board equipment on all new vehicles sold in North America and the Federal Government will install infrastructure on major roadways. This program is part of a plan to significantly improve roadway safety and utilization, lower travel times and provide unprecedented access to information for the driving public.

ST brings to the relationship its technology and product expertise in the automotive semiconductor arena as well as communications and location expertise. ACS, on the other hand, will offer its patent pending architecture for resolving some of the major challenges facing the VII initiative such as channel access, reliability of communications, and precision vehicle location at a much lower cost than current solutions.

"There is clearly enormous potential for the technology that ACS brings to solving problems facing the VII program," said Ugo Carena, corporate VP and general manager, automotive products group, ST. "STMicroelectronics' capability in automotive, wireless communication, and location, coupled with ACS' technology will provide significant advantages to the government, auto companies, and their suppliers."

"The synergy of our technology along with STMicroelectronics' technology and products will be a key contributor to VII," said Milt Baker, CEO of ACS.

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