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Nokia, ST finalize 3G chipset deal

Posted: 07 Nov 2007 ?? ?Print Version ?Bookmark and Share

Keywords:3G chipset? IC design? collaboration?

Nokia and STMicroelectronics (ST) have concluded their agreement, announced on Aug. 8, to deepen their collaboration on the licensing and supply of IC designs and modem technologies for 3G and its evolution.

The closing of the multifaceted agreement transfers a core part of Nokia's IC operations to ST and positions the Geneva-based company to design and manufacture 3G chipsets based on Nokia's modem technologies, energy management and RF technology. The agreement also includes the transfer of approximately 185 highly-skilled engineers and other Nokia personnel in Finland and United Kingdom to ST.

As part of the deal, Nokia has also awarded ST a design win of an advanced 3G High-Speed Packet Access chipset supporting high data rates. This design win represents ST's first complete 3G chipset.




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