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Through-hole tech shrinks camera modules for handsets

Posted: 12 Nov 2007 ?? ?Print Version ?Bookmark and Share

Keywords:though-hole technology? camera module? W-CSP?

Oki Electric Industry Co. Ltd has started a contract assembly service for wafer-level chip sized package (W-CSP) semiconductors using through-hole technology that allows sensor and camera module manufacturers to obtain camera modules half the size of conventional modules.

In order to miniaturize a camera module, it is necessary to miniaturize the image sensor in the camera module. Oki's new W-CSP technology includes creating a through-hole in the silicon substrate such as an image sensor, and putting an electrode through the hole. By using this technology on the image sensor, users can eliminate wire bonding for camera modules and thus, reduce the size. Oki also adopts a low-profile cover glass on the image sensor, enabling manufacturers to make a module thinner than conventional ones.

"Based on the through-hole W-CSP technology, manufacturers can make smaller camera modules, responding to trends such as the steadily shrinking size of mobile equipment," said Takaki Yamada, president of Silicon Microdevice Co. at Oki. "We plan to increase the production level to 10,000 wafers per month within the fiscal year ending March 2009 and are considering increasing up to 20,000 wafers per month by the fiscal year ending March 2010, taking the expected demand increase into consideration."

In September, the company established a volume production line for through-whole technology based W-CSP assembly at its production site in Tokyo and started operation in October. Going forward, Oki will also launch a contract manufacturing service for making ultra small camera modules as part of its e-functional module business.

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