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Infineon reveals new packaging technology

Posted: 14 Nov 2007 ?? ?Print Version ?Bookmark and Share

Keywords:Infineon eWLB? packaging technology?

Infineon Technologies AG unveils a new package technology, and has tapped Advanced Semiconductor Engineering Inc. as its IC packaging partner. According to Infineon, it has been successful in extending the benefits of Wafer-Level Ball Grid Array (WLB) by a new technology, embedded WLB (eWLB). Particularly, the new process has leveraged WLB advantages such as small package dimensions, excellent electrical and thermal performance, and maximum connection density. However, the eWLB significantly increases the functionality and application spread, claims Infineon. Due to eWLB, complex semiconductor chips such as modem and processor chips for applications in mobile communications require a high number of solder connections with standardized contact spacing to be produced with a minimal footprint. At the same time, the packages can be provided with as many solder contacts as needed. The possibility of additional wiring area around the chip proper means that the wafer-level packaging technology also lends itself to space-sensitive applications.

"We will use our development to set the stage for future package generations and are responding to future market demands and keeping Moore's Law in mind," said Hermann Eul, member of the management board of Infineon Technologies AG and head of the communications solutions business group. "As smaller pattern sizes and increasing performance require new, innovative approaches."

The new package form achieves a 30-percent reduction of dimension compared to conventional (lead-frame laminate) packages. Components using the new package are expected to be commercially available by the end of 2008.

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