Infineon-Intel team eyes high-density SIM cards

Infineon Technologies AG and Intel Corp. are working together for the development of optimized chip solutions for high-density (HD) SIM cards. Under the terms of the agreement, Infineon will architect modular chip solutions with Intel offering memory capacities from 4-64Mbytes. Infineon will develop a 32bit security MCU based on its existing SLE 88 family for use with HD SIM cards. Intel meanwhile, is contributing its leading-edge flash memory technologies, capabilities and manufacturing.

The initial development of the flash memory product line will scale up to 64Mbytes with NOR flash memory manufactured on 65nm and 45nm process technologies. All HD SIM solutions operate across the voltage range of 1.8-3.3V according to ETSI specifications. The SLE 88 family concept allows the OS software developed for existing SIM cards to be easily reused.

Samples of the Intel-Infineon HD SIM card solution will be available in 2H 08, with high-volume production expected in 1H 09. The products will be sold in die form or in a chip card IC package.