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'Terminal-on-a-chip' targets wireless backhaul

Posted: 19 Nov 2007 ?? ?Print Version ?Bookmark and Share

Keywords:mixed-signal CMOS chip? WiMAX backhaul? 3G? Ethernet?

Broadband wireless infrastructure chip specialist Provigent has started sampling a mixed-signal CMOS chip for backhaul infrastructure.

The company says some infrastructure equipment designers are already integrating and testing the device in their latest gear for 3G cellular/WiMAX backhaul and the next generation 3GPP Long Term Evolution (LTE) standard.

Dubbed the PVG610 "Terminal-on-a-Chip," the tightly integrated part is said to provide all necessary terminal building blocks required for indoor or outdoor units.

The SoC also provides the complete processing chain from user data interfaces through the high performance modem to carrier IF frequency. User data interfaces supported include PDH; E1/T1/J1 LIU & framers; SDH/SONET; STM-1/OC-3 Ethernet, 10/100/1000Mbit/s Ethernet GMAC and serial interfaces.

The part builds on the company's original single chip modem for wireless backhaul, the PVG310.

The architecture of the device is such that the user data streams from any or all of the available interfaces are aggregated and multiplexed. The modem technology performs encoding and offers QPSK through 256QAM modulations. The embedded high performance DAC converts the modulated signal into analog for IF transmission.

An embedded high performance ADC digitizes the received signal. Demodulation, decoding and mapping to the user data streams (interfaces) are all managed by an ARM9 processor.

The company also has facilities in California, and earlier this year raised $16 million in venture capital funding, bringing the total raised to $38 million.

- John Walko
EE Times Europe

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