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Vanguard finalizes purchase of Winbond's 200mm fab

Posted: 04 Jan 2008 ?? ?Print Version ?Bookmark and Share

Keywords:200mm fab? foundry capacity? wafer production?

Aiming to expand its capacity, Taiwan specialty foundry provider Vanguard International Semiconductor Corp. (VIS) has completed its acquisition of Winbond Electronics Corp.'s 200mm fab.

Under the agreement, announced March last year, VIS has acquired two lines, dubbed Fab 4 and Fab 5, from Winbond. The acquisition allows VIS to expand its 200mm output to 1.3 million wafers per year, from its current 840,000 production. Previously, the company had one 200mm fab, which has a monthly output of approximately 70,000 wafers.

VIS' new plant, dubbed Fab 2, is capable of 0.18- to 0.13? processes, which will produce driver ICs and high-voltage devices.

VIS has close ties to another foundry provider. Seeking to boost its 8-inch capacity, Taiwan Semiconductor Manufacturing Co. Ltd last year moved to gain further control of VIS. TSMC held a board meeting and approved a proposal to purchase no more than an additional 11 percent stake in VIS. TSMC currently owns approximately 26.8 percent of VIS' shares and if it moves on its purchase, TSMC would own nearly 38 percent of the company.

- Mark LaPedus
EE Times




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