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Winbond taps ESI solution for 70nm DRAM

Posted: 11 Jan 2008 ?? ?Print Version ?Bookmark and Share

Keywords:70nm DRAM? link processing? memory IC?

Electro Scientific Industries Inc. (ESI) announced that Winbond Electronics Corp. has adopted ultraviolet (UV) laser link processing to enable Winbond's move to 70nm advanced DRAM production.

In addition to purchasing a Model 9850UV dual beam semiconductor link-processing system, Winbond is planning to upgrade several of its existing ESI Model 9830 infrared (IR) laser memory repair tools to UV Model 9835HDE laser systems. ESI shipped the 9850UV system to Winbond in Taichung, Taiwan, in December 2007. Upgrade shipments are expected to commence sometime this year.

Winbond memory IC manufacturing VP Wilson Wen explained, "To meet our aggressive product roadmap, we look for the best cost of ownership (CoO) and return on investment across multiple technology nodes. We also chose to upgrade several of our IR laser systems to UV lasers to meet our 70nm production requirements."

"Purchasing the Model 9850UV along with upgrading to the 9835HDE's 100kHz laser capability enables leading customers like Winbond to achieve very high and very accurate energy delivery to smaller link geometries, which provides cost advantages by improving yields and throughput," stated Martin Igarashi, director of semiconductor link processing at ESI.




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