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Processor combines ARM9 CPU, 3D graphics engine

Posted: 14 Jan 2008 ?? ?Print Version ?Bookmark and Share

Keywords:multimedia application processor? ARM9 CPU? 3D graphics engine? DSP?

Magnum Semiconductor Corp. announced the ZEVIO ZV1050 multimedia application processor, the latest member of its ZEVIO SoC line for cost-effective and power-sensitive applications in consumer entertainment and information applications.

ZV1050 combines an ARM9 CPU with an advanced 3D graphics engine to deliver photo-realistic graphical images and game-quality effects on portable LCD or external TV displays.

The ZV1050 chip integrates multiple task-specific processors, distributing work as opposed to forcing all tasks to be run on a single CPU. The general purpose CPU is a 32bit ARM926 CPU running at 225MHz.

For graphical tasks, the chip integrates dedicated geometry and rendering engines for 3D graphics processing as well as a 2D graphics processor to overlay graphical content such as video and 3D with 2D character fonts. An integrated ZSP400 DSP core enables developers to process algorithmic functions such as A/V decode without affecting the performance of the CPU. 192Kbyte of internal memory can be used to reduce the access to external memory to lower system power consumption.

The ZV1050 supports playback of popular digital video formats, including MPEG-4 and H.264. The audio capabilities of the ZV1050 include 64-channel sound synthesis for MIDI playback, 3D positional audio for sound effects and decoding of popular compressed digital audio formats such as MP3, so that consumers can enjoy audiophile-quality music and game-quality synthesized audio effects. In addition, the digital audio input port and integrated DSP can provide audio encoding and voice recognition capabilities.Peripheral interfaces include two SDIO slots for memory card and I/O expansion, a USB 2.0 OTG interface to connect the system directly to a PC host or to a USB peripheral, an 8-channel 10bit ADC for touch screen and other sensor modules, and a CMOS/CCD camera interface to capture still or video images.

The Magnum Semiconductor ZEVIO ZV1050 is provided in 15mm x 15mm 233 BGA package. Power consumption is less than 200mW in typical applications.

Pricing starts below $8 for volume orders. Sample quantities available now.

- Ismini Scouras

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