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65nm mobile TV SoC supports all standards

Posted: 15 Feb 2008 ?? ?Print Version ?Bookmark and Share

Keywords:65nm single-chip mobile TV SoC? channel decoder? RF chip? worldwide TV standards?

Samsung Electronics Co. Ltd has announced a 65nm single-chip mobile TV SoC that combines a channel decoder with an RF chip. Samsung's S3C4F60 supports all worldwide TV standards with respect to frequency range and channel bandwidth, giving consumers the ability to enjoy real-time news, sports, weather forecasts and live entertainment anywhere.

"As consumers begin to embrace mobile TV, mobile service providers and telecommunication carriers will increase their offerings in a variety of new services aimed at improving customer retention and building new revenue streams," said Yiwan Wong, VP marketing team, System LSI division, Semiconductor Business, Samsung Electronics. "Samsung's S3C4F60 is the most advanced mobile TV receiver solution in the market in providing device manufacturers the flexibility to support the most popular mobile TV standards and broadcast frequency spectrums around the world using a single platform."

Spec compliance
The receiver chip supports six different mobile TV standards and complies with all related specifications of DVB-H/T (ETSI EN 300 744, EN 302 304, EN 301 192 and MBRAI); ISDB-T (ARIB-B29/ B31 1/ 3-Seg); T-DMB [Korean T-DMB, DAB (Eureka-147)]; and DAB/ DAB-IP standards. The integrated built-in multi-band RF tuner supports VHF III (174-240 MHz), UHF (470-862 MHz), and L-bands (1350-1750 MHz).

The S3C4F60 also boosts mobile performance. By achieving 180Hz Doppler frequency performance at DVB-H 16 QAM, 8K, 2/3 CR, and 1/4 GI, mobile TV products using the S3C4F60 can achieve perfect reception of digital TV signals, even inside high-speed trains like the TGV, ICE, or Shinkansen traveling at speeds of up to 300km/hr.

Fabricated in a 65nm process and housed in a 5mm x 5mm WL-CSP to minimize the footprint, the S3C4F60 integrates into a single chip an LNA, embedded SRAM, ADC, PLL, ARM 7 CPU and an LDO, thereby reducing the number of external components needed.

The S3C4F60 is scheduled for mass production in Q3 2008 and samples will be available starting March.




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