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Latest IC solutions take center stage at IIC-China 2008

Posted: 15 Feb 2008 ?? ?Print Version ?Bookmark and Share

Keywords:2008 IIC-China? digital home platform? power supply design?

The 13th International IC-China Conference & Exhibition (IIC-China) will kick-off in Chengdu City Feb. 28 at Chengdu New International Exhibition and Convention Center. It will offer electronics designers of China a fresh line-up of IC technologies as well as vendor seminars on key industry trends. Organized by Global Sources and CMP Media LLC, the show will run until March 11 and will be held in Shenzhen, Beijing and Shanghai.

Edwin Kwong, senior VP of Fujitsu Microelectronics Pacific Asia Ltd will introduce technologies used in the digital home and explain the unified digital home platform supporting multimedia home, digital entertainment and network sharing.

To discuss techniques on "powering smart, connected, service-oriented devices" is Kevin Dallas, general manager of Microsoft Windows embedded business unit. He will describe the design requirements of future intelligent devices and how they can be used to provide instant and seamless information, entertainment and production services to consumers. He will also talk about new business models and opportunities for OEMs, enterprises and service providers.

Moreover, David Bell, president, COO and director of Intersil, will introduce applications and trends of high-performance analog ICs.

A/V, power design
IIC-China 2008 will also be a venue for technology forums which will focus on A/V and power supply design.

One of the summits is "Next-generation A/V design." A/V design is highly integrated in consumer electronics and automotive electronics systems and has currently become a focus of most China electronic manufacturers and engineers. The summit forum in Shenzhen will adopt CEO round table conference style to encourage conversations among the top executives of companies in the field.

In the summit forum "Towards power efficient design," semiconductor companies TI, Maxim, Infineon, ON Semiconductor, Power Integration, Microchip and NXP will discuss challenges to fulfill higher efficient and more reliable power supply transferring. The summit forum will also introduce new power supply standards, technologies, devices and system design considerations. For example, TI will introduce portable power management IC trends while Power Integration will explain where the energy losses occur in a power supply system and will suggest strategies to optimize efficiency in the general system. NXP will also share insights on how to make PC power solutions green.

Vendor seminars by semiconductor companies will include digital consumer electronics, embedded system, automotive electronics, RF/wireless, power supply management and communications facilities. Leading semiconductor companies will give their analysis and design solutions. Intel will give an introduction and analysis of the growing embedded market while NEC will tackle automotive electronics design. Semtech will discuss its off-chip ESD protection solution and Atmel will lecture on ultralow power consumption and flash MCUs. Leadis will talk on LED charge pump and dynamic back-light controllers, Optichron on comprehensive basestation solutions and TriQuint on its highly-integrated RF module.

Micrel, ADI, Cyan Technology, Freescale, Weiking International Company, Altera and MIPS will also share the new technologies, equipment, solutions and market trends to participants.

Technology zones
IIC-China 2008 in Shenzhen and Shanghai will have specialized technology zones showcasing two of today's hottest technologiesPower and RF Microwave. The Technology Zones will enable China's engineers to stay at the very forefront of these fields.

The Power Technology Zone will focus on technologies ranging from power ICs to battery management and inverter modules. The RF & Microwave Technology Zone will focus on the application of wireless solutions across cellular, Internet and near-field applications.




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