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White multichip LEDs dissipate heat efficiently

Posted: 21 Feb 2008 ?? ?Print Version ?Bookmark and Share

Keywords:heat sinks? thermal dissipation? white multichip LED?

InGaN white LED

Allegro MicroSystems Inc. has announced a new series of white multichip LEDs that provide a range of high-powered InGaN white LEDs that can be used in general lighting applications, amusement and gaming equipment and for backlighting TFT displays.

Each module combines eight LEDs in two separate channels. Modular design allows the SEPW devices to be easily assembled into string arrays by simply connecting the modules in a series. The devices also promise superior color balance throughout the display because of the high density of LEDs that can be achieved. This minimizes the distance that power and control lines must run between LED modules and from the LED modules to the control electronics, the company said.

The white thermoplastic case is an innovative design with superior heat dissipation properties. The white resin compound is formulated for superior reflectance and transmittance of the generated light. Enhanced thermal dissipation is achieved through the incorporated heat sink on the bottom of the package. The heat sink can be mated directly to an external radiator through the PCB for superior heat conduction allowing dense placement of modules.

The leadframe is plated with silver, providing a highly-reflective surface for the bottom and sides of the emitting area. The terminals and heat sink are also silver-plated.

Allegro MicroSystems is one of the exhibitors in the upcoming IIC-China 2008.

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