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Multilayer chip capacitor allows ESR values to be set

Posted: 25 Feb 2008 ?? ?Print Version ?Bookmark and Share

Keywords:chip capacitors? ESR value? internal structure?

1608, 2012

TDK Corp. has announced that it has developed a multilayer ceramic chip capacitor that's said to be the first to feature a new internal structure that allows ESR values to be set to any value within a specified range, stabilize ESR values and control circuit impedance (alternating current resistance). Mass production of the capacitor, available in 1608 and 2012 configurations, began this month.

In conjunction with the smaller size and increasingly advanced functions of electronic devices such as PCs and mobile information terminals, manufacturers are making strong demands for reduced mounting areas and miniaturization of components. As a result, power supply circuits on boards with increasing mounting densities must combine multiple capacitors of different types, which means that impedances must be adjusted over broad frequency ranges. The effects of the minute electrical resistance elements present in the capacitors themselves can cause interference among multiple capacitors depending on the frequency, which can lower noise suppression effects. Generally, it is necessary to use even more components to control these effects.

To address this concern, TDK developed a capacitor with a new internal structure that allows ESR values to be set while maintaining the same capacitance as earlier products. Because the ESR values of capacitors located in the vicinity of the CPU can be set, there are smaller changes in impedance between the power supply and the CPU over a broad range of frequencies as well as voltage variation limiting effects. Limiting the variation in voltage stabilizes the current signal and eliminates effects on other circuits. In addition, the new capacitor will likely contribute to a reduction in the number of components needed.

The new capacitors are suitable for use in applications that require high power supply quality such as communications base stations and high-end PCs, and will contribute to reductions in the number of components, space saving and smaller products. The mounting method is the same as that for two-terminal products, making switching from existing components easy.

Although the sizes are the same as earlier products of the same type, resistance has been improved to 1,200m for the 1608 product and 500m for the 2012 product and the ESR values can be set to any value within a specified range.

By adding resistance components, the variation in impedance frequency is lower than earlier products, which will contribute to reducing the number of components needed compared to earlier products.

Sample price for the 1608 component is 18 cents and 55 cents for the 2012 component. Production starts this month.

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