Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Embedded

Chip takes place of three in XFP modules

Posted: 26 Feb 2008 ?? ?Print Version ?Bookmark and Share

Keywords:single-chip solution? analog signal processing?

A single-chip solution featuring 10Gbit/s dual clock data recovery (CDR) with electronic dispersion compensation engine for use in 10GBASE-LRM XFP modules has been announced by Inphi Corp.

The 3200E integrates Inphi's patented analog signal processing EDC technology with XFI-compliant transmit and receive CDRs in a compact 7mm x 7mm QFN package. Replacing up to three separate chips, the 3200EC simplifies the design and reduces the BOM of an XFP transceiver module.

Used with Inphi's 1348TA linear trans-impedance amplifier (TIA), the 3200EC reduces development costs and accelerates delivery of standards-compliant 10GBASE-LRM XFP modules.

The devices are available immediately as engineering samples with mass production expected in the second quarter of 2008.

- Ismini Scouras

Article Comments - Chip takes place of three in XFP mod...
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top