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Manufacturing/Packaging??

Yole sees increasing WLP adoption in ICs

Posted: 26 Feb 2008 ?? ?Print Version ?Bookmark and Share

Keywords:wafer-level packaging? WLP technology? CMOS?

Yole Dveloppement released an analysis on the adoption of wafer-level packaging (WLP) in semiconductors based on the idea that WLP technology can be implemented in the most cost sensitive applications and will scale favorably with the trend to manufacture on increasing wafer diameters.

The French research and strategy company indicated that about 35 percent of CMOS imagers in cellphones and notebook cameras are now encapsulated in a wafer-level chip scale package (WL-CSP). It expects the technology will penetrate about 63 percent of this market by 2012 and will "progressively spread from CIF/VGAs to higher resolution image sensors."

According to Yole, ICs represent the largest potential for WLP and is likely to grow from 2.5 percent of the mainstream IC with about 6 billion units up to 4 percent by 2012. GaAs wireless RF chips are one of the most dynamic market segments with a CAGR over 100 percent from 2007 to 2012, added Yole.

For MEMS, Yole indicated that it is more a Wafer Level Capping (WLC) approach that was developed and not a "true WLP." The market analyst then forecasts that production of first real WLP for MEMS, started in 2006, will represent a "significant" portion of the market by 2012. Companies like Samsung, Dalsa Semiconductor, Hymite, Silex Microsystems, Infineon, IMT, TMT and VTI have reported advanced developments in this sense.

- Anne-Francoise Pele
EE Times Europe




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