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Freescale-ST collaboration yields automotive MCUs

Posted: 28 Feb 2008 ?? ?Print Version ?Bookmark and Share

Keywords:automotive MCUs? industry collaboration? silicon?

The first automotive MCUs jointly designed by Freescale Semiconductor and STMicroelectronics have rolled. Freescale and ST have produced first silicon from their respective wafer fabs in Austin, Texas, and Agrate Brianza, Milan, Italy, for MCUs targeting powertrain, body, instrument cluster and safety/chassis applications. Manufactured on the two companies' aligned 90nm embedded-flash technology, the four Power Architecture MCU are initial results from the companies' joint design program initiated two years ago.

"The system-on-chip platform enables us to quickly develop multiple automotive products incorporating optimized peripheral sets and embedded flash memory, fine-tuned for specific automotive applications," said Denis Griot, chairman of Freescale EMEA and global automotive marketing.

ST and Freescale are extending the aligned product road map through ongoing work at joint design centers in Naples, Agrate, Sao Paulo and New Delhi's National Capital Region. Staffed by more than 150 design engineers, these design centers are focused on developing next-generation MCU products optimized for specific automotive market segments.

Lead automotive customers will receive samples of the jointly developed MCU products throughout Q1 08. The two companies plan to provide general automotive market product information, pricing and availability for the dual-sourced products later this year.

ST and Freescale are exhibitors in the upcoming IIC-China 2008.

- Colin Holland
EE Times Europe




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