Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > RF/Microwave
?
?
RF/Microwave??

Multi-carrier dev 't platform debuts for wireless base stations

Posted: 08 Apr 2008 ?? ?Print Version ?Bookmark and Share

Keywords:HSPA+? TD-SCDMA? LTE? WiMAX? wireless development platform?

Texas Instruments Inc. has rolled a scalable, programmable development ecosystem enabling base station OEMs to support multiple carriers of established and evolving wireless standards from a single platform. Based on TI 's multicore TMS320TCI6487 and TMS320TCI6488 DSPs and multi-interface software libraries, the development platform covers all major air interfaces including GSM-Edge, HSPA+ HSPA+, TD-SCDMA , LTE and WiMAX. With a single development platform, OEMs largely "design once-deploy multiple" base stations, significantly reducing design costs, while speeding the deployment of new 3G features and beyond 3G standards.

Apart from reducing development time, TI makes designing easier by supporting both MAC and PHY processing on the same platform. The high performance DSP platform also eliminates the need for an expensive, power-hungry FPGA, with the exception of WiMAX designs. CommAgility, a designer and manufacturer of embedded signal processing cards, uses TI 's multicore DSP to support its AdvancedMCTM module AMC-6487 product, targeted at high-performance processing roles in wireless baseband and other applications. The board is designed around three TMS320C6487 DSPs or the pin-compatible TMS320C6488 DSP and an optional WiMAX-required FPGA, providing wireless baseband developers the processing power they need to support their high-capacity solutions.

Multi-carrier platform
TI 's baseband platform delivers significant capex savings to the operator by offering the highest number of carriers per channel card and enabling them to support new features and standards on the same baseband hardware.

The table below highlights the capacities supported by CommAgility 's AMC-6487 baseband card for some key commercial wireless standards:

The cost savings and flexibility offered by the DSP-based AMC-6487 common baseband platform also helps OEMs differentiate their network infrastructure products.

The multi-standard DSP platform from TI provides the operators with the flexibility to support new standards and features based on market need. For example, 3G operators can use the TI DSP-based platform to support W-CDMA-HSPA today and upgrade to HSPA+ or LTE on the same hardware when they see the market need for these new applications. Similarly, TD-SCDMA operators can upgrade to LTE-TDD, and in some cases GSM-EDGE operators can upgrade to LTE.

End-to-end performance
The TCI6487 and TCI6488 wireless infrastructure baseband processors make use of TI 's TMS320C64x+TM DSP core and an abundance of performance power to support processing-intensive high density applications.

The multicore DSPs have on-chip accelerators, which eliminate the need for an FPGA or a microprocessor for GSM-EDGE, HSPA, HSPA+, TD-SCDMA and LTE applications. Both DSPs include OBSAI and CPRI compliant antenna interfaces on chip that support direct connectivity over the backplane to a RF transceiver card or to a remote radio head (RRH).

As the only semiconductor provider to offer a complete analog signal chain for 2G/3G/Beyond3G air interfaces, TI also offers OEMs a complete portfolio of high performance analog products, including optimized RF products, high performance data converters, clock devices and power management products.

The AMC-6487 common baseband card based on TI 's multi-core DSP is currently sampling and will be available in Q2 08.





Article Comments - Multi-carrier dev 't platform debuts...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top