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DNP, Unimicron to put up printed wiring board JV

Posted: 10 Apr 2008 ?? ?Print Version ?Bookmark and Share

Keywords:high density printed wiring boards? joint venture?

Dai Nippon Printing Co. Ltd (DNP) and Unimicron Technology Corp. have agreed to establish UD Alliance Technology Ltd in Hong Kong. The $5.13 million joint venture, which is to be established in late June, will specialize in the manufacturing and marketing of printed wiring boards based on B2itTM DNP's buildup board manufacturing technology.

The location of the joint venture is aimed to meet the demand of mobile terminal makers to have a printed wiring board center near China and Asia, where the manufacturing of mobile phone terminals is done.

The new company will sign a patent license agreement covering B?it technology with DNP, and manufacture and market printed wiring boards based on this technology.

B?it is DNP's technology for buildup printed wiring board, which connects adjacent conductive layers by the bumps made of a high conductivity paste, formed by screen printing and penetrated insulating layer. As there is no plated-through hole for electrically connecting between conductive layers, that leaves a broader area on which to mount parts, and as the wiring layout can be freely carried out throughout all the layers this technology also has the characteristic of allowing for broad latitude in wiring design.

The new company will contract manufacturing to the Unimicron factory in Kunshan, China, and will market end products to DNP and Unimicron in the first instance.

Aside from helping DNP strengthen its production of printed wiring boards based on B?it, and further expand its business, by providing B?it-related technology support to Unimicron, both companies believe the joint venture will also pave way for the standardization of B?it technology.

The investment ratio for the joint venture is 66.5 percent for Unimicron and 33.5 percent for DNP.

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