Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Manufacturing/Packaging
?
?
Manufacturing/Packaging??

Winbond, Qimonda team up on next-gen DRAM

Posted: 24 Apr 2008 ?? ?Print Version ?Bookmark and Share

Keywords:Qimonda? Winbond? DRAM?

Is the Qimonda-Nanya DRAM venture in Taiwan dead in the water?

Germany's Qimonda AG this week said that it has signed a technology license and foundry agreement for its new 65nm "buried wordline" technology with Taiwan's Winbond Electronics Corp. For years, Qimonda has had various foundry alliances with Nanya, Winbond, SMIC and others.

Qimonda is also in discussions with other potential partners regarding its new DRAM technology. It disclosed the information during its quarterly results Apr. 21.

The German company recently announced a 4.5F2 cell technology that will let it extend its DRAM process to the 30nm node. The move also means that Qimonda is "abandoning its trench-capacitor technology in favor of more-conventional, stacked-capacitor technology," Gartner analyst Andrew Norwood wrote in a recent e-mail newsletter.

Meanwhile, the announcement with Winbond raises more questions about Nanya Technology Corp.'s own DRAM road map and its partnership with Qimonda. Nanya and Qimonda have a joint manufacturing venture in Taiwan called Inotera Memories Inc.

It would seem like Qimonda would initially work with Nanya on ''buried wordline''instead of Winbond, observers speculated.

At the same time, Micron Technology Inc. recently entered a surprising R&D and DRAM partnership with Taiwan memory rival Nanya. Formed to share the soaring development and manufacturing costs for DRAMs, the alliance could be a threat to Qimonda and Inotera.

- Mark LaPedus
EE Times





Article Comments - Winbond, Qimonda team up on next-gen...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top