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High-density connector delivers high signal density

Posted: 29 Apr 2008 ?? ?Print Version ?Bookmark and Share


Tyco Electronics Corp. has introduced the Z-PACK Slim UHD (Ultra High Density) connector series that is designed to support the increasing demands for higher signal density in small system slot pitches. The connector family consists of a right-angle receptacle, vertical header and guiding modules. The Z-PACK Slim UHD portfolio will be completed with the addition of a right-angle header (coplanar) and power modules.

The Z-PACK Slim UHD product is an upgradeable connector system, fitting in 15mm (0.6-inch) system slot pitch applications and above. This connector offers a high contact density of 55 pins/cm? or 355 pins/inch?. It is also said to provide excellent signal performance.

By exchanging the daughtercards, two different receptacle connector performance versions are created, enabling the application to be upgradeable and, at the same time, cost-effective, Tyco said. The Common Speed (CS) version can be used for signal speeds up to about 3.5Gbit/s. The High Speed (HS) version is capable of operating at +20Gbit/s. Both receptacle versions have identical envelope dimensions and mate with a uniform header connector.

The low-profile and high-density features allow designers to reduce the board spacing between adjacent daughtercards in a rack, making room for more cards or reducing the size of the application. The connector system can also assist in thermal management within the system by creating less obstruction to cooling airflow. The over-molded signal contacts in the receptacle, in combination with the plastic ribs embedded in the header design, result in a reliable and highly protected interconnect solution, Tyco said.

Mated signal pricing for HS signals is around $0.094, based on an HS version in a 2.0 DP/column assignment and in higher volume quantities (>50,000 pieces/year). Lead-time will vary between four to eight weeks.

- Gina Roos

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