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Singapore inventor gets patent for flip-chip IC assembly tech

Posted: 30 Apr 2008 ?? ?Print Version ?Bookmark and Share

Keywords:assembly method patent? flip-chip? device assembly?

Teck Kheng Lee of Singapore has been granted U.S. patent for his development of a method for assembling a flip-chip semiconductor device.

The invention, with U.S. Patent No. 7,348,215, assigned Micron Technology Inc., covers a method for assembly of one or more flip-chip-configured IC dice with an interposer substrate to form a flip-chip-type IC device assembly. The flip chip-type device assembly includes a conductively bumped IC die and an interposer substrate having a plurality of recesses formed therein, according to the U.S. Patent & Trademark Office (USPTO).

The abstract of the invention, provided by the USPTO, stated, "The semiconductor die is mounted to the interposer substrate with the conductive bumps disposed in the plurality of recesses so that the die face is adjacent the facing surface of the interposer substrate. One or more openings may be provided in an opposing surface of the interposer substrate which extend to the plurality of recesses and the conductive bumps disposed therein. Dielectric filler material may then be introduced through the one or more openings to the recesses and, optionally, between the semiconductor die and interposer substrate."





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