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Chip meets USB 2.0 ESD protection needs

Posted: 08 May 2008 ?? ?Print Version ?Bookmark and Share

Keywords:USB 2.0 ESD protection? zero insertion loss?


STMicroelectronics has met the complete ESD protection requirements for High-Speed USB, including Vbus, in an ultraminiature QFN-6 device measuring 1mm x 1.45mm x 0.65mm. With 0.85pF maximum capacitance at 240MHz, the USBULC6-2M6 minimizes distortion and helps designers meet the 10pF maximum specified line loading for operation up to 480Mbit/s.

The compact footprint and low package height make the USBULC6-2M6 suitable for mobile phones, handheld computers, personal media players and other portable high-speed communicators requiring IEC61000-4-2 protection. The device meets level 4 specifications to 15kV air-gap discharge and 8kV contact discharge, and has a breakdown voltage of 6.1V. In addition, the low maximum leakage current of 0.5?A reduces power consumption and preserves battery life.

The USBULC6-2M6 is internally optimized for maximum signal transparency, and features a go-through pin arrangement to simplify board layout and preserve impedance matching of the complete data line.

By providing two complementary protection-diode networks, with capacitance matching within 0.1pF, the USBULC6-2M6 is suitable for a wide range of high-speed differential and single-ended signaling applications.

Zero insertion loss is specified up to 3GHz, allowing use in applications such as GbE and future high-speed protocols. Other benefits include very low clamping voltage compared to metal oxide varistors, which is are alternative devices for the application, to provide enhanced protection for sub-100nm CMOS ICs.

The USBULC6-2M6 is available now at 20 cents for orders over 1,000 units.

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