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Advantest eases high-volume DDR3-SDRAM testing

Posted: 13 May 2008 ?? ?Print Version ?Bookmark and Share

Keywords:memory test system? parallel test capability?

Advantest Corp. is touting its T5503 high-throughput memory test system as having the industry's highest parallel test capability of up to 128 devices.

The T5503 was developed specifically to address the challenges of high-volume production test of next-generation high-speed DDR3-SDRAM. The memory tester will be available from August and will also be on display at the "Advantest Tour de Force 2008" exhibition to be held at the Tokyo International Forum, June 3-5.

The T5503 enables package test of up to 128 DDR3-SDRAM devices simultaneously. This is double that of the company's previous models, enabling a major reduction in test costs for high volume production lines. With maximum test speeds of 3.2Gbit/s and data transmission speeds of more than 1Gbit/s, the T5503 is well-suited for high-volume production testing of DDR3-SDRAM, as well as for GDDR3 and GDDR4.

The tester's semiconductor circuitry makes full use of the latest CMOS technology to achieve greater packaging density, reducing the footprint by approximately 40 percent over the previous model, and leading to space savings in high-volume production lines. Power consumption has also been reduced by approximately 45 percent compared to the system's predecessor, enabling environmentally friendly operation.

Advantest's proprietary multi-strobe capabilities, introduced in the company's previous model, T5501, have been further enhanced in the T5503. Supporting source-synchronous test with the use of multi-strobe technology that measures the phase difference between data output from the device and the reference clock signal at each clock cycle, the system provides high-speed, high-precision test.

- Ismini Scouras
eeProductCenter





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