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Samtec announces new Edge Rate contact solutions

Posted: 22 May 2008 ?? ?Print Version ?Bookmark and Share

Keywords:interconnects? contact solutions? Edge Rate?

ERM8/ERF8, RU8 Series

Samtec Inc. has expanded its line of board-to-board and cable-to-board solutions featuring its rugged Edge Rate contact. These systems are designed for applications where signal integrity and durability are critical. These specially designed contacts promise superior impedance matching, reduced broadside coupling and crosstalk, and high cycle life.

Board level systems include the robust 0,8mm pitch Edge Rate interconnect strip system (ERM8/ERF8 Series) and the high-speed RiseUp MicroCard stacking system (RU8 Series). SEARAY open pin field arrays (SEAM/SEAF Series) and DP array differential pair arrays (DPAM/DPAF Series) offer high-density solutions with maximum grounding and routing flexibility.

Cable-to-board systems include the signal integrity optimized 0,8mm pitch, 50 micro coax Edge Rate strip (ERCDA Series) and 100 Twinax Data Bank high-speed/high-density systems (GCCA/GCAM Series), as well as the 100 Twinax MicroCard assembly (EEDP Series).

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