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Mobile WiMAX IC integrates advanced baseband functionality

Posted: 22 May 2008 ?? ?Print Version ?Bookmark and Share

Keywords:WiMAX? mobile? base station? USB?

French WiMAX chip supplier Sequans Communications SA has rolled out a mobile single-chip solution, which is claimed to integrate advanced baseband functionality, including RF and SDRAM.

Sequans said the SQN1170 is the sixth mobile WiMAX chip it has delivered, after a Mobile WiMAX Wave 1 chip in 2006; two baseband Mobile WiMAX Wave 2 chips in 2007 for base station and mobile stations; and two RF chips (2.5GHz and 3.5GHz). "The SQN1170 chip measures 12mm x 12mm; has throughput of more than 30Mbit/s; and draws less than 600mW in peak multiple input, multiple output mode," it added.

Among other applications, Sequans cited mobile handsets, smart phones and PDAs. The new mobile WiMAX chip also targets embedded PC applications enabling WiMAX into MID and UMPC devices, as well as small form factor PC accessories like USB dongles.

The product release came after Sequans raised $28 million in a fourth round of equity-based and convertible debt financing. At that time, Sequans stated that the funds would be used to launch its next-generation chips.

Mitsumi, a manufacturer of multichip and system-in-package modules, has been using Sequans' chips to manufacture Mobile WiMAX modules. The first devices Mitsumi delivered to its customers were a standard-definition card based on Sequans' SQN1130 Mobile WiMAX baseband chip and a secure digital input output (SDIO) module based on Sequans' SQN1130 baseband and SQN1140 RF chips.

Mitsumi claimed it will be the first to use Sequans' SQN1170 chip to develop an SDIO module comprising full Mobile WiMAX system functionality. The module, it added, offers manufacturers a flexible solution to build high-performance, low power-consuming Mobile WiMAX end user devices.

- Anne-Francoise Pele
EE Times

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