Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Power/Alternative Energy
?
?
Power/Alternative Energy??

High-power density promise from bus converter

Posted: 23 May 2008 ?? ?Print Version ?Bookmark and Share

Keywords:bus? converter? Vicor VI BRICK?

Vicor Corp.'s brick business unit has added the VI BRICK BCM bus converter to its new VI BRICK family that provides an advanced modular power platform for power solutions. These modules can be used to provide an isolated intermediate bus to power multiple non-isolated POL converters or as an independent power source.

Offering 390W/in3, the high-power-density module can also be used in high-power, high-efficiency data center applications to power individual cards or blades directly from the HV distribution bus, said the company.

The VI BRICK BCM module uses advanced Sine Amplitude Converter (SAC) technology, thermally enhanced packaging technologies, and advanced manufacturing processes to provide high power density and efficiency, superior transient response, and improved thermal management, Vicor said. The VI BRICK BCM offers high efficiency up to 96 percent and operates from primary bus voltages of 48V and 350/380V to deliver isolated outputs with a range of voltages from 1.5-48Vdc depending on the model.

Due to the fast response time and low noise of the BCM, the need for capacitors at the load is reduced or eliminated, Vicor said. This is complemented by the capacitive multiplication effect of the BCM where the required input capacitance of the niPOL can be significantly reduced, by a factor of the square of the BCM transformation ratio. This is achieved by placing the capacitance at the input of the BCM, resulting in savings of board area, materials, and total system cost.

VI BRICK BCM models are available in a base temperature grade of -40 C to +100C, operating, and -40 C to +125C, storage, with a slotted-flange baseplate and through-hole pin style. All modules are RoHS compliant and compatible with lead-free wave soldering processes. These models are offered in a footprint of 2.08in? with a low profile of 0.37 inches (dimensions of 1.91in x 1.09in x 0.37in (48.6mm x 27.7mm x 9.5mm). Price starts as low as $44 in OEM quantities.

- Gina Roos
eeProductCenter





Article Comments - High-power density promise from bus ...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top