QuickLogic's platform offers compact mobile packaging

In addressing the needs of the mobile device market, QuickLogic Corp. has made its ArcticLink customer specific standard product (CSSP) platform available in a tiny wafer level chip scale package (WLCSP).

The platform family provides the connectivity needs of mobile devices by offering, in a single device, an array of configurable interfaces and host controllers, including hi-speed USB on-the-go with built-in PHY, storage and networking I/Os and controllers such as SDIO, MMC, CE-ATA, mini-PCI, Compact Flash and SPI/UART. The newly available WLCSP option helps minimize mobile device design size necessary to augment processor interfaces and functionality.

WLCSP eliminates the area overhead of conventional BGA packaging and it is achieved with a standard die by fabricating an additional metal redistribution layer to reroute the I/O lines from the perimeter bonding pads to an array. It then "bumps" solder balls to the array, making it ready for customers' use in conventional surface-mount fabrication processes.

- Clive Maxfield
Programmable Logic DesignLine