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ST's fab targets volume ramp production

Posted: 30 May 2008 ?? ?Print Version ?Bookmark and Share

Keywords:wafer? fab? manufacturing? embedded flash?

STMicroelectronics NV (ST) has earmarked $500 million in capital expenditure to take its Crolles2 wafer fab manufacturing capacity between 4,500 and 5,000 wafers per week. "We want to fulfil the capacity of the building," said Carlo Bozotti, president and CEO, ST.

This will mark the transformation of Crolles2 from an R&D and pilot production center to a volume fab, which will also perform customization of 32nm and 22nm CMOS processes developed within the IBM common platform consortium.

"The money will be spent over the next few years according to the demand and the degree to where ST outsources production from high-end production to foundry partners," said Bozotti. He added that Crolles would be ST's premier site for advance digital CMOS, and it will be able to produce 32nm and 22nm circuits. The company's 45nm process is expected to qualify for production at the end of June.

Recently, ST has a manufacturing capacity at Crolles2 of about 2,700 wafers per week produced using a 65nm CMOS process. It has spent approximately $500 million buying up the chip-making equipment that previously owned by its partners at Crolles, Freescale Semiconductor Inc. and NXP BV. The process will be completed by July 2008.

Bozotti said the process extensions that would be developed at Crolles2 would also be important. "Ultra low-power CMOS is an important process for mobile and embedded flash. We have an embedded flash program with Freescale on 90nm and we are moving that to 65nm," he added. He noted ST was working on the expansion of the network of companies that would focus on the process extensions at Crolles. "We are not looking for manufacturing partners, but for technology R&D partners," stressed Bozotti.

- Peter Clarke
EE Times

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