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Infineon readies tiny 3G solution for HSDPA, HSUPA

Posted: 10 Jun 2008 ?? ?Print Version ?Bookmark and Share

Keywords:HSDPA? HSUPA? 3G?

Infineon Technologies AG has come up with a new generation of 3G platform family. This new platform family, says the company, addresses all major 3G market segments and includes a high performance HSPA modem solution. Moreover, Infineon adds that the platform family reduces the number of devices in the chipset from three to two and the component count of a typical platform by 50 percent. The solutions are based on new members of the X-GOLD 61x-series and the 3G RF transceiver device, the SMARTi UE. The X-GOLD 61x-series are monolithically integrated, low power 65nm baseband devices that include all digital, analog and power management functions.

"Our new platforms enable our customers to fully reuse their hardware and software developments and launch multiple phones covering all feature phone market segments with lower cost and faster time-to-market," said Hermann Eul, executive VP of the Infineon management board and president of the communication solutions business group.

The platform XMM 6180 with the X-GOLD 618 baseband offers HSDPA/HSUPA capabilities of 7.2Mbit/s/2.9Mbit/s, an integrated high-end video accelerator for recording and playback of VGA video content and the ability to connect to cameras with up to 5Mpixel.

The platform XMM 6170 with the X-GOLD 617 baseband on the other hand supports HSDPA 3.6Mbit/s, recording and playback functionality of QVGA video content and the ability to connect to cameras with 2Mpixel.

As for the modem platform solution XMM 6160 with the X-GOLD 616 baseband, it offers HSDPA/HSUPA capabilities of 7.2Mbit/s/5.8Mbit/s and includes hardware and software interfaces to an application processor or a PC as wireless modem.

All baseband chips are manufactured in 65nm and packaged with Infineon-pioneered eWLB package technology, resulting in a dimension of 8mm x 8mm x 0.8mm, which are also pin compatible across all platforms. Additionally, Infineon includes its next-generation multiband RF transceiver chip, SMARTi UE, into all its dual-mode platforms supporting three and four frequency bands for W-CDMA and EDGE standards, respectively.

Verified samples and evaluation boards are available by end of June. Volume production starts in the 2H 09.





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