Guidelines on leadforming, trimming lead length, and heatsink mounting

The ever-increasing demand for smaller consumer products often results in semiconductor designers manipulating package configurations to fit intended designs. More specifically, designs often require custom leadforming and module assembly practices for packages like the TO-262. TO-220, and TO-247. It is the intent of this application note to introduce general guidelines to ensure basic protection to the integrity of the package, both mechanically and electrically. Improper handling of devices can result in immediate or latent failures from cracked epoxy, epoxy delamination, die fractures, and bond-wire shearing.

Fairchild Semiconductor tests the electrical integrity of the devices as supplied. Once leads and/or package configuration is altered from its original state, the integrity of the device cannot be guaranteed. The reliability of the package within the application becomes the responsibility of the designer.

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