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Phase change interference materials suit Intel's Penryn

Posted: 02 Jul 2008 ?? ?Print Version ?Bookmark and Share

Keywords:interference material? phase change material? Penryn? mobile processor?

Laird Technologies Inc. has released two new products in its T-pcm phase change line of thermal interface materials optimized for Intel's Penryn quad-core mobile processor.

The unique material formulation softens at regular chip operating temperatures to fill the microscopic irregularities found in the surfaces of the microchip package and heat sink. The proprietary mix of thermally conductive fillers and resins minimizes resin migration and pump-out to extend the lifetime of the electronic device.

Both T-pcm 670 and T-pcm 680 meet the requirements of Penryn and pass Intel's performance and reliability requirements. In addition, the T-pcm 670 and T-pcm 680 phase change materials are inherently tacky for easy application and flexible for easy handling.

Laird's T-pcm phase change thermal interface materials are engineered to improve the functionality and processing speeds and meet the demanding thermal reliability and cost requirements of computer applications. All T-pcm phase change thermal interface materials exceed the requirements of the RoHS directive 2002/95/EC and the tighter environmental specifications embraced by Laird's OEM customers.

"With the launch of T-pcm 670 and T-pcm 680, Laird Technologies is targeting mobile PCs and other applications where reliability and performance are critical considerations," said Michael Sutsko, Laird's general manager, thermal products business unit. "These products build on our existing T-pcm technology and are ideal for customers' most demanding electronic thermal applications."





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