Laird Tech takes wrap off thermal interface material

The T-flex 700 is the next generation thermal pad in the T-flex gap filler line. It improves the thermal performance of the T-flex line by increasing the thermal conductivity to 5W/mK. The soft material is highly compliant, allowing for thinner interfaces and overall improved thermal performance as measured by total thermal resistance. High compliancy accommodates applications where the tolerance stack-up is high and the maximum mechanical stress on the components must be low. A low shore OO hardness value of 50 helps maintain device reliability when mechanical shock and vibration are important design considerations. The T-flex 700 is naturally adhesive for ease of handling and assembly.

The T-flex 700 thermal material is available worldwide through Laird Technologies' sales and manufacturing locations. Thickness ranges currently available include 0.04-0.2-inch (1mm to 5mm) in 0.01-inch (0.25mm) increments. The product is available in standard sheets or die cut parts that can be custom-made to specification. Another available option is adhesive on only one side. The T-flex 700 material will be extended as thin as 0.02-inch (0.5mm) by year-end.

The T-flex 700 is a high-performance solution available to mechanical design engineers working on a wide range of electronic devices including notebooks and desktops, servers, wireless base stations and radio heads, laptops, LED lighting, STBs, LCD and PDP TVs, automotive electronics, and general applications employing heat pipes, heat sinks or thermal modules.

The T-flex 700 gap filler thermal interface materials meet the requirements of the RoHS Directive 2002/95/EC issued January 2003 and new standards for low BDA and PFOS. The material has even lower concentrations of banned substances as required by leading OEM customers.