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STATS ChipPAC, Infineon ink eWLB manufacturing deal

Posted: 29 Aug 2008 ?? ?Print Version ?Bookmark and Share

Keywords:manufacturing agreement? packing technology? wireless application?

STATS ChipPAC Ltd has entered into an agreement with Infineon Technologies AG to provide manufacturing services for products based on Infineon's first generation embedded Wafer-Level Ball Grid Array (eWLB) technology.

The relentless market demand for complex and power efficient semiconductor devices within a continuously shrinking package footprint is increasingly constrained by the lack of physical pad connection space. Infineon has alleviated these constraints via the development and introduction of the eWLB, a fan out wafer level packaging technology. Manufacturing services for the eWLB will be located at STATS ChipPAC's operation in Yishun, Singapore.

"Infineon introduced the first generation of eWLB in 2007 as a dynamic technology that offered small package dimensions, improved electrical and thermal performance, and maximum connection density for wireless applications," said Wah Teng Gan, VP of assembly and test at Infineon Asia Pacific. "Our manufacturing partnership with STATS ChipPAC ensures we will be able to expand the number of highly integrated wafer level packages manufactured with eWLB technology."

"eWLB is an innovative technology that offers a high performance, power efficient solution for the wireless market. Our partnership with Infineon to provide manufacturing services for eWLB technology aligns with our strong focus on leading edge integration technology," said Han Byung Joon, executive VP and chief technology officer of STATS ChipPAC.





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