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Tegal secures products, IP for 3D packaging, MEMS

Posted: 04 Sep 2008 ?? ?Print Version ?Bookmark and Share

Keywords:Tegal IP product? packaging 3D? MEMS?

Tegal Corp. has signed an agreement with Alcatel Micro Machining Systems (AMMS) and Alcatel-Lucent to acquire their Deep Reactive Ion Etch (DRIE) and Plasma Enhanced Chemical Vapor Deposition (PECVD) products, and the related intellectual property, directed at advanced 3D wafer-level packaging applications. The restricted stock and cash deal, valued at $5 million, is expected to close later this month. As part of the agreement, Gilbert Bellini, president of AMMS, will be appointed to Tegal's board of directors.

The agreement calls for the continued support by AMMS of the existing installed base of DRIE tools in use by MEMS and integrated device manufacturers. Tegal will continue the development of the AMMS DRIE product line, including the integration of the AMMS process modules on its recently-introduced Compact bridge platform and the completion of a 300mm process chamber. In addition, Tegal will assume responsibility for AMMS' joint development programs with key customers, as well as research and academic institutions.





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