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Alchip taps Sony Semi's packaging tech for ASICs

Posted: 05 Sep 2008 ?? ?Print Version ?Bookmark and Share

Keywords:ASIC packaging? design service? Sony package technology?

Open foundry ASIC provider Alchip Technologies Inc. has selected Sony Corp.'s Semiconductor Group to be their package partner in advanced SoC ASIC solutions for its worldwide customers.

Alchip offers total solutions ranging from SoC design services to high-volume mass production. The partnership agreement with Sony will enhance Alchip's total ASIC solutions to its customers by providing advanced high-yield package technology with manufacturing capabilities that have been proven in high-end consumer electronics such as mobile handsets, portable gaming and consumer devices.

"Customers trust Alchip to provide the most competitive ASIC solutions especially when products require minimal space, increased memory density and different memory types combined into a multichip package," said Kinying Kwan, CEO of Alchip. "We continue to make available to customers cost, power, and size advantages even at the system level. Through Sony's leading-edge technology and our fast time-to-market advantage, Alchip enables customers to utilize world-leading solutions for advanced applications."

"By taking advantage of the leading edge and wide range of System-in-Package technology cultivated by Sony's consumer products history such as more than two decades of DVC, DSC and Gaming, Alchip customers will enjoy high yield solutions at competitive costs and the comfort of knowing that our package solutions are also used in our consumer products," said Shunichi Hashimoto, senior general manager, Sony Semiconductor.





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